HERNDON, VA – The International Electronics Manufacturing Initiative, an industry-led consortium focused on identifying and closing technology gaps, has published its 2007 research priorities.

The top priority for manufacturing processes shifted from development of reduced cost manufacturing processes that support rapid miniaturization to development of a new methodology/strategy for R&D to be conducted in the global outsourcing environment.

While there is still a need to continue improvements to the IT infrastructure, the top research need currently identified for system integration is the development of 3D interconnect structures with associated thermal management, reports iNEMI.

According to the group, the top two research priorities for energy and environment are the development of sound scientific methods to evaluate environmental impact of materials and research into the development of new innovative energy sources.

The top research priority in materials and reliability is the development of the next generation of solder alloys with better area array shock, lower cost, lower temperature and reduced copper dissolution issues, the researchers add. And the second research priority is the development of halogen-free materials.

The top priorities for design are improved, integrated and standardized DfX tools for compatibility across supply chains, and low-cost solutions for carrying >10Gb/s signal rates between components on a PCB, iNEMI says. 

The document identifies R&D priorities for the next 10 years by combining findings from this year’s Roadmap with R&D needs identified through follow-on gap analysis meetings.