NEW YORK – The global electrodeposited copper foils market is expected to exhibit a CAGR of 11.6% from 2017 to 2025, in terms of valuation, says Persistence Market Research.
The market is expected to rise to revenue of more than $16 billion in 2025 from an estimated of $6.7 billion by the end of 2017. In terms of volume, the market is expected to exhibit a CAGR of 8.3% from 2017 to 2025, rising to a figure of 774,918 tons by 2025, says the research firm.
Printed circuit boards are expected to remain the leading revenue contributor to the global market, exhibiting an 11.6% CAGR over the forecast period, with revenue rising to $11.4 billion in the year 2025.
The foil thickness segment less than 20μm is presently the highest grossing segment, valued at nearly US$4.9 billion in 2017 and is likely to remain the top grosser over the forecast period, exhibiting a CAGR of 12.8% from 2017 to 2025.
The foil thickness segment above >50μm is expected to exhibit a CAGR of 5.7% over the forecast period, rising to $1.07 billion in 2025.
The Asia Pacific market is presently the leading regional market and is likely to continue to lead in terms of incremental opportunities, as well as revenue contribution to the global market over the forecast period. The Asia Pacific market is foreseen to exhibit a CAGR of 12.1% from 2017 to 2025, rising to $14.7 billion in 2025.