LISLE, Ill.Molex Incorporated has begun production at a new facility in St. Paul, Minn. Molex relocated to the new facility from the former Century Circuits operation Molex acquired in 2006. The new, expanded facility offers improved manufacturing process flow and provides more than double the production capacity for Copper Flex products. According to Molex, it has made significant investments in new equipment to ensure that the facility is both more efficient and capable of producing expanded product technologies for the future.

The new facility includes improved temperature and humidity controls that provide the capability to produce multi-layer flex products with more than 20 layers. Molex will now prototype and manufacture rigid flex assemblies at this new location.

“Molex continues to invest in its operational facilities to provide the most efficient manufacturing processes and best possible products to our customers,” said Todd Hester, general manager, printed circuit products group, Molex Incorporated. “Our new Copper Flex facility will not only increase our product output, but provide a better work environment for employees to manufacture the industry's leading product solutions.”

The location also employs new lean manufacturing processes that support progressive manufacturing techniques that will improve plant efficiency and overall product quality. The implementation of Class 10,000 clean room capabilities will also allow for future product directions for fine line flex products.

“Molex Copper Flex products meet the challenging needs of today's technology driven world and are able to replace a variety of electronic interconnects, simplifying the production process and making it more dependable,” said Gary Manchester, marketing director, Molex Incorporated. “Molex has invested in its capabilities to ensure we produce Copper Flex materials that are superior, quality products.”
IRVINE, CAAcer Inc. today announced the purchase of Gateway Inc. for $710 million. The deal has the support of both companies’ boards and is expected to close by December.
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ARLINGTON, VA – A copy of the working draft of J-STD-709, Definition of Maximum Limits on Bromine and Chlorine Used in Materials for Low Halogen Electronic Components and Assemblies, is available for review.
 
Please return comments to This email address is being protected from spambots. You need JavaScript enabled to view it. by Sept. 21.
 
The committee will meet on Sept. 25 in Schaumburg, IL. Information on registration, venue, etc. for the meeting can be found at www.ipcmidwestshow.org.
SAN JOSE, CA – Joseph R. Bronson has been named president and COO of Sanmina-SCI Corp., and was elected to the board of directors, the EMS provider announced Thursday.
 
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TAIWAN – Taiwan-based Foxconn has unveiled its first software base in mainland China, according to a report from ChinaTechNews.com. This comes after the company signed a letter of intent with the municipal government of Nanjing earlier this year.
 
According to the report, CEO Terry Guo said the company chose the Pukou district of Nanjing for its facility, which will design wireless communications networks, enterprise information security and medical software.
 
The company plans to recruit 30,000 software engineers in five years for the Nanjing site, according to media reports. The site is now operational with more than 200 software developers.
TAIPEI, TAIWAN Laird Technologies announced that it signed a distribution and lamination agreement with ITEQ Corp. The combined resources of ITEQ and Laird Technologies uniquely positions both companies to supply solutions to the growing LED based BLUs for LCD Flat Panel Display.
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