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  • Thermal Vias are Ineffective. Here’s Why.

    Thermal Vias are Ineffective. Here’s Why.

    Adding thermal vias can take up valuable board space with little benefit.
      READ MORE...

  • Connecting the Industry, from Boards to Assemblies

    Connecting the Industry, from Boards to Assemblies

    HDP is embarking on new rounds of evaluations of laminates and lead-free solders.
      READ MORE...

  • Exploring the Impact of AI

    Exploring the Impact of AI

    A special panel discusses the growth of AI tools and its possible effects on the industry.
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  • A Journey in Rigid-Flex Design

    A Journey in Rigid-Flex Design

    Overcoming the challenges of rigid-flex designs can be incredibly rewarding.
      READ MORE...

  • Creating the Ultra Library

    Creating the Ultra Library

    Building and maintaining what's said to be the world's largest CAD database requires strong relationships.
      READ MORE...

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Fab News

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Category: Fab News

CHANDLER, AZ – JX Nippon Mining & Metals has named Ticer Technologies its exclusive global manufacturer and marketer of TCR thin film resistor copper foil.

Ticer’s original license was for North America only, president David P. Burgess noted. No financial terms were disclosed.

TCR can be purchased directly from Ticer or through all major US laminators in the form of rigid or flexible panels.

Ticer said it would continue to expand the design for TCR and its use in other world markets.

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BANNOCKBURN, IL -- IPC today released the first industry-consensus guidelines on handling, packaging and storing printed wiring boards.

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Category: Fab News

SHENZHEN -- Dongguan Somacis Graphic PCB reported second-quarter sales rose 98% over a year ago on higher demand for rigid-flex boards. Read more ...

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TAIPEI – EIPC has issued a call for abstracts for the 12th Electronic Circuits World Convention. The event will take place here Nov. 9 - 11.

Presentations are sought in electronics global market trends, management strategies and advanced and emerging technologies. Submissions focusing on green technologies, energy conservation and recycling and product miniaturizations are encouraged.

Abstracts should be 400 to 500 words, non-commercial, should summarize previously unpublished research and discoveries, and discuss significant test results and trends.

The deadline for abstracts is Jan. 15. To submit, visit www.ecwc12.org or email This email address is being protected from spambots. You need JavaScript enabled to view it..

The event will be held in conjunction with TPCA Show 2011 and is organized by the Taiwan Printed Circuit Association, with support from the World Electronic Circuits Council.

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TAIPEI -- Hon Hai (Foxconn) chairman Terry Gou lowered the electronics manufacturing company's long-term growth target by half to reflect a saturated computer market.

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CHICAGO -- Methode Electronics reported fiscal 2011 first-quarter net income increased to $4.1 million compared to breakeven in the same period a year ago.

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