MIGDAL HA'EMEK, Israel - Camtek Ltd. announced that it received a multi-million dollar order for automated optical inspection (AOI) systems from a leading PCB manufacturer based in Taiwan.
The order includes forty four of the new 3G family Dragon and Orion AOI systems recently presented to the market. In addition, the order includes upgrading thirty two of existing systems to 3G performance and more than 20 units of new CVR100 verification systems. The new systems will be installed at the customer's new plant in China and the revenues will be recognized during the third and fourth quarters of 2007.
PRACHIN BURI, THAILAND — CMK Corp. will reportedly invest four billion baht ($135 million) to increase capacity in its PCB factory in Thailand. The new equipment is scheduled to be installed by March 2008.
SANTA ANA, CA - Christopher Associates Inc. announces the addition of Dan Amador to their technical sales staff. Mr. Amador, a graduate of Loyola Marymount University in international business, has over 15 years sales and marketing experience in the electronics manufacturing industry specializing in printed circuit fabrication technology. His responsibilities will include applications, engineering, sales, and support of the Christopher Groups’ printed circuit fabrication product lines.
Christopher Associates Inc. provides sales, service, and support of the Dainippon Screen automatic optical inspection systems; C Sun cut sheet laminators, imaging systems, and curing systems; Masonelectrical test systems; MachVision hole inspection systems, and Shoda Techtron fabrication systems. The company is also one of the leading suppliers to the electronics assembly industry.
HAVERHILL, MA – DKN Research, an advanced printed circuit engineering firm, and NY Industries Co., Ltd., an Otsu, Japan-based manufacturer of flexible substrates, co-developed a printing process package to produce high-density flexible electronics circuits.
The companies created a series of printing process technologies generating fine traces with micro via holes for functional printable electronics. The process is said to be capable of producing single-side, double-side and multi-layer circuits with embedded passive and active elements.
The process is comparable to copper circuits generated by fine-etching with photolithography. The technologies are capable of printing resistor materials, high-dielectric constant materials and various active materials, including semiconductors.
Anisotropic conductive materials can be printed for connections with other circuits and devices.
The manufacturing process does not use any wet chemicals, so there are no chemical waste byproducts.