– UP Media Group Inc.
, parent company of Circuits Assembly
and Printed Circuit Design & Manufacture
, has issued a call for abstracts for PCB East 2008, which will be held May 11-16 at the Holiday Inn Select and Convention Center in Tinley Park, IL.
PCB East annually provides attendees and vendors with a conference and exhibition focused on the design and fabrication of PCBs, high-density interconnect and other advanced circuits.
The five-day conference program focuses on PCB engineering, design and fabrication. The conference is comprised of a three-day technical conference and a professional development certificate program of one-day and two-day courses.
The event also includes a two-day exhibition of top industry vendors to be held May 13 – 14.
Papers and presentations of the following durations are sought for the technical conference: 30-minute paper sessions; one-hour lectures, presentations or panel sessions; two-hour workshops or panel sessions, and half-day seminars.
Papers and presentations of the following durations are sought for a Professional Development Certificate program of in-depth courses: one-day tutorials (7 hours of instruction); two-day tutorials (14 hours of instruction)
Papers and presentations must be noncommercial in nature and should focus on technology, techniques or methodology rather than on a company’s specific products.
Some suggested paper and presentation topics include (but are not limited to): high speed, high frequency and signal integrity; component placement; EMI/EMC analysis; thermal analysis; lead-free processes (especially how they affect design and fabrication); RF and microwave design; packaging design; mixed-signal design; area arrays; FPGA design and implementation; embedded passives and active devices; flexible circuitry; HDI design and technologies; PCB design/layout basics; component library creation and management; design for manufacture, test and assembly; design (including analog, digital and power supplies); PCB fabrication; soldering; surface finishes; industry forecasts, and business and supply chain issues.
If selected, final papers and presentations will be due in March.