ALBUQUERQUE, NM — TE Connectivity and 3D Glass Solutions are collaborating on the development of electronic interconnect devices using glass-based system-in-package (SiP) technology.
The agreement leverages 3DGS’ patented Apex Glass technology and its existing glass-based systems and components with TE Connectivity’s device, design, and packaging technology.
3DGS fabricates electronic packages and devices using photo-definable glass ceramics. Electronic interconnect devices manufactured by 3DGS are said to reduce chip size up to 70% and cut power up to 50%. They also reportedly increase wireless bandwidth up to 50%, while accommodating band applications ranging from DC to 100GHz.
“3DGS’ photo-definable glass provides the highest systems-level integration of passive and active devices for SiP products compared to any other packaging technology in the market today,” said Ganesh Bhatt of TE Connectivity.
“We are extremely pleased to be partnering with TE Connectivity on this glass-based SiP application and are confident that this joint collaboration will accelerate the development of new enabling technology”, said Jeb Flemming, chief executive of 3DGS. “Our high-value system integration, combined with proven low-cost high-volume manufacturing, will provide significant product differentiation for TE Connectivity.”