Sarcon SPG-20B thermal interface compound is a low-viscosity thermally conductive silicone. Delivers thermal conductivity of 2.1 W/m°K and a thermal resistance of 1.8°C cm2/W. When applied between a heat-generating component and a nearby heat sink or spreader, the material reportedly fills all gaps to improve cooling performance. Requires no heat curing; does not cause corrosion on metal surfaces, and maintains initial properties across a temperature range of -40° to + 150°C. Has vibration absorption.
Fujipoly America, www.fujipoly.com