TWX-40 allows gold deposits up to 8μin in ENIG and ENEPIG processing in a single step.
Is a reduction-assisted immersion gold bath that deposits gold using both immersion and autocatalytic (electroless) reactions. Autocatalytic feature allows gold to build without attacking the underlying electroless nickel layer. Deposit uniformity is independent of pad sizes and PCB surface geometry, or residual capacitance potential. Plates directly on electroless palladium or nickel without intermediate activation. Plating speed is 0.12μm/15 min. at 78°C. Bath reportedly exhibits excellent stability and fine geometry edge resolution.
Uyemura International Corp.