AC-7303 copper-clad laminate offers thermal conductivity of 3W/mK, a reported modulus 1/10 that of conventional materials, and flexible dielectric layer (after curing).

Has an aluminum-base that creates soft insulation layer even after thermosetting. Soft insulation layer absorbs thermal expansion of aluminum plate. Thickness is 120μm. Young modulus (GPa) is 2.4 @RT. Maintains integrity even with thermal cycling of -55⁰/125⁰C. Is used for low solder crack tolerant applications such as automotive electronics and power supplies.


Risho AC-7303 web

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