RO4460G2 low-loss bondply has a 6.15 dielectric constant (Dk).
The 0.004" (0.101 mm) bonding layer complements RO4360G2 low-loss, glass-reinforced 6.15 Dk copper clad thermoset laminates. Exhibits excellent Dk control for repeatable electrical performance, low z-axis expansion for plated through-hole reliability, and thermoset bond temperatures compatible with standard epoxy/glass (FR-4) processes. For multilayer designs requiring sequential laminations; withstands multiple lamination cycles. UL V-0 flame retardant rated, and compatible with lead-free processes.