AcceleRate HD 0.635mm pitch, multi-row interconnect system provides an ultra-high density interface and next generation bandwidth.

ADM6, ADF6 series has up to 240 total I/Os in 1.88” sq. in. (12.1 sq. cm) of PCB real estate. Has four rows of pins, available in up to 60 pins per row, with a 5mm wide insulator footprint. Mated stack height is 5mm. Incorporates Edge Rate contact system, optimized for signal integrity performance. Rated to 56Gbps with PAM4 modulation. Solder ball technology is standard, as are alignment pins and body polarization. RoHS compliant and Pb-free solderable.


Samtec ASM3 web

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