MacuSpec VF-TH 200 is a DC electrolytic copper metallization process for simultaneous via filling and through-hole plating.
Can fill 3 x 3 to 5 x 3 mil vias in under 60 min. with a dimple of less than 10µm. Reportedly eliminates the need for pre-dip and flash plating process steps.
MacDermid Enthone Electronics Solutions