Ultra Dimension PCB AOI integrates leading pattern inspection, laser via inspection, Remote Multi-Image Verification (RMIV) and 2D metrology. Uses varied light settings and three different types of images to improve detection capabilities, reduce false alarms and decrease inspection setup time.
Is said to eliminate need to use inspection masks. Automatically measures both top and bottom conductor widths for lines and pads of a wide variety of shapes, enabling higher accuracy and impedance control necessary for SLP/mSAP as well as advanced HDI applications. Enables remote verification of multiple image defects, which are automatically and simultaneously acquired during inspection. Multi-image technology enables accurate differentiation between real and false defects.