Z-planner v. 1.0 field-solver-based PCB stackup planning and materials selection tool is optimized for hardware engineering teams that may or may not be familiar with exhaustive details of laminate and PCB fabrication processes.
Includes comprehensive PCB laminate library, Mentor Graphics HyperLynx boundary-element 2D-field solver, and Field Solver Sandbox. (Sandbox also available as a standalone product.) Includes import/export interface with HyperLynx. Imports HyperLynx stackups, including materials library and combines with awareness of glass styles, resin contents, pressed prepreg thicknesses, the frequency-dependence of dielectric constants (Dk) and dissipation factors (Df), and automation of the PCB stackup design process. Is said to improve accuracy of signal integrity tools. Reportedly bridges gaps between stackup spreadsheets and PCB signal-integrity. Has a bidirectional IPC-2581 interface.