TechniFlex LCL1000F/423M direct imaging fine-pitch matte black solder mask is for flexible applications.

Is suited for assembly conditions, including hot-bar soldering or multiple lead-free reflows. Reportedly shows no cracking after multiple 180° bends, even when processing 12µm polyimide substrate. Has less than 10µm of undercut. Provides high-resolution on 50µm solder dams with excellent chemical resistance to ENIG, ENEPIG, Ag and Sn finishes. Is available in two versions: U6 for direct imaging/manual exposure and U7 for either direct imaging/manual exposure or roll-to-roll coating operations.

Technic
technic.com


PCB West, the Silicon Valley's largest PCB industry trade show, takes place next week. Register now at pcbwest.com!

Submit to FacebookSubmit to Google PlusSubmit to TwitterSubmit to LinkedInPrint Article