ST-Line solder mask and dry-film pretreatment process equipment is fully compatible with CupraEtch pretreatment chemistry and reportedly boosts yields to control production costs.
Is for pretreatment and adhesion promotion of primary imaging resists and solder masks. For use on inner and outerlayer photoresist pretreatment as well as solder mask pretreatment (compatible with all final finishes, including ENIG and IMT) processes across MLB, HDI and package substrates. Meets rigorous safety standards. Easy to operate, intuitive safety controls and fully controlled temperature detection in dryer module. Considerably reduces wastewater.