Ansys 17.0 features improvements across the entire workflow, from modeling to post processing. SpaceClaim Direct Modeler speeds time to CAE with improved performance for importing complex models and more tools for faster geometry creation and editing. New industry-specific vertical solutions facilitate OEM-supplier interactions while adhering to such industry standards, such as ARINC 664/653, FACE and AUTOSAR. Chip-package-system design workflow for electronics is more tightly integrated and automated, and now includes across-the-board performance improvements for power integrity, signal integrity and EMI analyses. High performance computing improvements provide 20 to 60X performance gains for package and board simulation. Thermal analysis in now integrated and automated in SIWave.