FEATURES

Expect ultra-thin/coreless package substrate technologies, thinner dies – and new assembly techniques.

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The evolution from Gerber to Industry 4.0 is well on its way.

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By controlling the geometry, we can control reflections. But the rules of conduction are the same.

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In PCB transmission lines, a correct design can render leakage negligible.

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Nano-tech 2018 was held at Tokyo Big Sight Feb. 14-16.

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Why does ENIG or other lossy plated finishes increase insertion loss?

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