FEATURES

By tightening controls over materials, the risk of recalls and fakes is slashed.

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A DoE of laminate, copper balance and panel configuration.

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At the beginning of January, PCD&F/CIRCUITS ASSEMBLY asked a number of PCB industry executives to answer a handful of questions about the upcoming year.

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Simulated and experimental conclusions of temperature imbalances show significantly more efficient cooling around the outside of corners.

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Ensuring perfect alignment to avoid damage to traces.

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The last electronics trade show of the year has held on Dec. 14 for three days at Tokyo Big Sight.

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