Assemblers demand a complete CAD data package for more effective manufacturing.
Panelization, also known as the processing of boards in an array format, keeps small boards attached to each other within a single, larger substrate. Panelization is used to process multiple small boards through assembly, and is becoming more prevalent as board sizes shrink.
Printers are becoming more and more versatile. Now they can even print sensors and electronic components on 2D and 3D substrates. A new, robot-assisted production line allows the process to be automated.
Stencil design software has evolved from simple rule checkers to custom, sophisticated engineering tools.
QFNs, microBGAs and 0201s keep showing up everywhere. They used to appear only on boards requiring miniaturization; now they are used on revisions of legacy products, bringing a new set of headaches for process engineers.