Is Fan-out Wafer-level Packaging Right for Your Product?
FO-WLP offers the ability to support more I/O, a smaller vertical footprint, cost reduction by eliminating the interposer, and improvements in electrical and thermal performance. But achieving these advantages requires overcoming some significant challenges.
by Narayanan (TV) Terizhandur
Semi-Additive Process for Low Loss Buildup Material in High-Frequency Signal Transmission Substrates
To decrease signal loss and increase signal integrity at a high transmission speed, the surface of dielectric materials should be very smooth, with excellent adhesion between them and fine-line circuitry. A novel material promotes signal integrity at high frequencies through high plating-resin adhesion and a smooth dielectric interface.
by Fei Peng, Ph.D., Naomi Ando, Roger Bernards and Bill Decesare