PCD&F Archives

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FEATURES

FO-WLP
Is Fan-out Wafer-level Packaging Right for Your Product?

FO-WLP offers the ability to support more I/O, a smaller vertical footprint, cost reduction by eliminating the interposer, and improvements in electrical and thermal performance. But achieving these advantages requires overcoming some significant challenges.
by Narayanan (TV) Terizhandur

ADDITIVE PROCESSING
Semi-Additive Process for Low Loss Buildup Material in High-Frequency Signal Transmission Substrates

To decrease signal loss and increase signal integrity at a high transmission speed, the surface of dielectric materials should be very smooth, with excellent adhesion between them and fine-line circuitry. A novel material promotes signal integrity at high frequencies through high plating-resin adhesion and a smooth dielectric interface.
by Fei Peng, Ph.D., Naomi Ando, Roger Bernards and Bill Decesare

 

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