PCD&F Archives

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FEATURES

THERMAL MODELING
Empirical Confirmation of Via Temperatures

Current doesn’t determine the temperature of a via; rather, it is the temperature of the associated traces. If the traces are sized correctly for the current level, much smaller and fewer vias are required to transition between trace layers than has been previously believed. In practical terms, designers can have much greater flexibility in freeing routing channels underneath the traces on their boards.
by Douglas Brooks

 

FIRST PERSON

 

MONEY MATTERS

 

TECH TALK

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FEATURES

SIGNAL INTEGRITY
Insertion Loss Modeling

Lessons from a study that attempted to correlate measured insertion loss to that modeled with an Intel-proprietary 2D modeler and a commercially available tool using a collection of coupons representing a range of materials and vendors.
by Jeff Loyer

THERMAL OVERLOAD
Empirical Results of Fusing Tests

Trace thermal overload situations can be grouped into two broad categories. But even slight current overloads result in unpredictably long fusing times – sometimes hours.
by Douglas G. Brooks, Ph.D.

SMT ASSEMBLY
Creative Technological Solutions for Complex PCBs

What the optimal assembly solution for a 2-mil-thick flexible PCB is, and other mysteries.
by Arbel Nissan

SHOW RECAP
Machines in Munich

The biennial Productronica trade show – the industry’s largest outside Japan – was filled with new machines, if not necessarily new technologies.
by Mike Buetow

 

FIRST PERSON

 

MONEY MATTERS

 

TECH TALK