THERMAL MODELING Empirical Confirmation of Via Temperatures Current doesn’t determine the temperature of a via; rather, it is the temperature of the associated traces. If the traces are sized correctly for the current level, much smaller and fewer vias are required to transition between trace layers than has been previously believed. In practical terms, designers can have much greater flexibility in freeing routing channels underneath the traces on their boards. by Douglas Brooks
SIGNAL INTEGRITY Insertion Loss Modeling Lessons from a study that attempted to correlate measured insertion loss to that modeled with an Intel-proprietary 2D modeler and a commercially available tool using a collection of coupons representing a range of materials and vendors. by Jeff Loyer
THERMAL OVERLOAD Empirical Results of Fusing Tests Trace thermal overload situations can be grouped into two broad categories. But even slight current overloads result in unpredictably long fusing times – sometimes hours. by Douglas G. Brooks, Ph.D.
SMT ASSEMBLY Creative Technological Solutions for Complex PCBs What the optimal assembly solution for a 2-mil-thick flexible PCB is, and other mysteries. by Arbel Nissan
SHOW RECAP Machines in Munich The biennial Productronica trade show – the industry’s largest outside Japan – was filled with new machines, if not necessarily new technologies. by Mike Buetow