PCD&F Archives

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FEATURES

CAD SOFTWARE
Price vs. Function

Functionality, breadth of features and ease of use top what designers like most about their preferred CAD software. But their biggest concern is not speed; it’s cost.
by Chelsey Drysdale

STANDARDS
IPC-1782: The New Dawn of Electronics Traceability

Traceability is thought of as expensive, complex, unreliable, incomplete, a threat to business and different for everyone. Can a new standard for electronics overcome those hurdles?
by Michael Ford

PCB DESIGN
5 Common Mistakes in Board Design
From wrong component selection to thermal imbalance, many of the most frequent yield spoilers are fixable.
by Arbel Nissan

TRANSITIONS
In Memoriam
Remembering those who left us in 2016.

 

FIRST PERSON

 

MONEY MATTERS

 

TECH TALK

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FEATURES

THERMAL MANAGEMENT
How AC Currents Affect PCB Trace Temperatures, Part 2

Past articles looked at the relationship between trace current and temperature for pulses that propagated through the trace. A look at the slightly more complicated topic of analog waveforms to see if the same conclusions apply.
by Douglas G. Brooks, Ph.D. and Dr. Johannes Adam

PCB MATERIALS
Nano Anchoring Copper Foil for Next-Generation Printed Wiring Boards

Newly developed treatment technology for copper foil enables ultra-low profile surfaces.
by Osamu Suzuki, Akito Yoshii, Hironobu Tsubura, Makiko Sato, Naoki Obata and Yoshinobu Kokaji

How Can the IoT Be a Solid Rock to Build Products and Profits On?
by Jon Howes

 

FIRST PERSON

 

MONEY MATTERS

 

TECH TALK

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FEATURES

HIGH-SPEED DESIGN
Analyzing the DDR Simulation Results

After looking in past months at critical signal integrity concerns that engineers face designing the DDR bus, and points to consider while setting up the simulation, this month the author discusses what to look for in the results of the simulation.
by Nitin Bhagwath

HIGH-FREQUENCY MATERIALS
Choosing Copper Foils for High-Frequency PCBs

Perhaps surprisingly, the same type of electrodeposited copper processed with two different treatments can yield two different levels of circuit performance. Thinner materials for microwave boards benefit from smooth surfaces to decrease insertion loss.
by John Coonrod

 

FIRST PERSON

 

MONEY MATTERS

 

TECH TALK

1609cover

 

FEATURES

TRACE MODELING
How AC Currents Affect PCB Trace Temperatures

Methods for estimating how AC currents behave on PCB traces, and verification with empirical testing.
by Douglas G. Brooks, Ph.D., and Dr. Johannes Adam

RIGID-FLEX DESIGN
Ensuring Reliable Products with New Rigid-Flex Design Rules

Using both the rigid and the flexible areas of a PCB for component placement, while possible, introduces new design constraints that require more advanced PCB design strategies. Rules and guidelines for routing and placement.
by Jim Frey

 

FIRST PERSON

 

MONEY MATTERS

 

TECH TALK

1608cover

 

FEATURES

TRACE MODELING
How AC Currents Affect PCB Trace Temperatures

Methods for estimating how AC currents behave on PCB traces, and verification with empirical testing.
by Douglas G. Brooks, Ph.D., and Dr. Johannes Adam

RIGID-FLEX DESIGN
Ensuring Reliable Products with New Rigid-Flex Design Rules

Using both the rigid and the flexible areas of a PCB for component placement, while possible, introduces new design constraints that require more advanced PCB design strategies. Rules and guidelines for routing and placement.
by Jim Frey

IPC Material Declarations: Sufficient for Automotive Electronics?
IMDS and IPC-1752A are different tools for reporting materials data, created by separate industries for different purposes. Suppliers of automotive electronics are obligated to use both, but should they?
by Derrik Snider

 

FIRST PERSON

 

MONEY MATTERS

 

TECH TALK

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FEATURES

CONDUCTOR TEMPERATURES
The Dynamics of PCB Trace Heating and Cooling, and a Call to Action

After rigorous study, the authors have identified the major parameters responsible for trace heating and cooling, and quantified the effects of many of them. Here they highlight the most important parameters, illustrate their individual effects on trace heating and cooling, and then suggest two areas where additional research is needed.
by Douglas G. Brooks, Ph.D., and Dr. Johannes Adam

HIGH-SPEED DESIGN
Preparing to Simulate DDR Memory Bus Interfaces

In order to increase the odds of a functional board on the first pass and reduce the number of spins required, it is usually wise to simulate the design before fabricating the board. That said, the time required to set up, run and analyze the simulation also needs to be fast enough to make the investment in simulation worthwhile. How to speed up the process of designing a functioning system.
by Nitin Bhagwath

SURFACE FINISHES
Extreme Long-Term Printed Circuit Board Surface Finish Solderability Assessment

Could the surface finishes of a group of test specimens, found some 20 years after their fabrication, hold up to today’s testing measures? And what impact does finish thickness have on future solderability?
by Gerard O’Brien and Dave Hillman

CONSORTIA
iNEMI Roadmap Gets Industry Aligned

Industry leaders are fast at work on the iNEMI 2017 Roadmap, the biennial tome that serves as an answer to the ongoing question of what’s next for manufacturing technology. And while other industry efforts to chart the future are losing steam, iNEMI’s are still going strong.
by Mike Buetow

 

FIRST PERSON

 

MONEY MATTERS

 

TECH TALK