PCD&F Archives

January 2015 cover

 

FEATURES

PACKAGING
Cost/Benefit Tradeoffs of Capacitor Part Size vs. Manufacturing Efficiency

Passives continue to eat up 70% of the board area. How smaller part sizes require less solder and can eliminate parasitic inductance.
by Chris Reynolds

COMPONENT PROCESSING
Embedded Passive Technology Materials, Design and Process

EPT can simplify assembly and test processes and reduce the actual cost, especially when using 0201 packages or lead-free processes. A summary of resistor material selection, evaluations and duplication of a complex digital design.
by Hikmat Chammas

 

FIRST PERSON

 

MONEY MATTERS

 

TECH TALK

Submit to FacebookSubmit to Google PlusSubmit to TwitterSubmit to LinkedInPrint Article