PCD&F Archives

1512cover

 

FEATURES

SIMULATION
Field Solvers for Transmission Line Analysis: How Similar Are They?

An essential element in circuit board design is engineering the stackup to achieve specific transmission line properties, like characteristic impedance and crosstalk. The best tool for this is a field solver, either a 2D or 3D. But with so many commercially available, the question is always which one to use? A study of six commercial field solver tools evaluates the relative precision and compares their predictions.
by Gaurav Narula and Dr. Eric Bogatin

HOLE RELIABILITY
Conductive Inks vs. Nonconductive Inks for Via Fill

Just 15 years ago, filling a via was considered a specialty process limited to a small group of product applications and almost exclusively to one material: conductive ink. Today, many nonconductive inks are superior in performance, and much less expensive, than their conductive cousins.
by Roy Akber

RETROSPECTIVE
In Memoriam

A look back at friends and colleagues who left us in 2015.
by Mike Buetow

 

FIRST PERSON

 

MONEY MATTERS

 

TECH TALK

Submit to FacebookSubmit to Google PlusSubmit to TwitterSubmit to LinkedInPrint Article