BANNOCKBURN, Ill., USA, March 14, 2018 — IPC — Association Connecting Electronics Industries® invites engineers, researchers, academics, technical experts and industry leaders to submit technical conference abstracts and course proposals for IPC APEX EXPO 2019 to be held at the San Diego Convention Center.
Read more: IPC Issues Call for Participation for IPC Apex Expo 2019
San Diego, CA, US, March 13, 2018 – VPIphotonics and Computer Simulation Technology GmbH (CST), part of SIMULIA, a Dassault Systèmes brand, announce their partnership to seamlessly couple full-wave photonic device simulation and overall circuit simulation and analysis of integrated photonic components and subsystems within a single framework at OFC 2018, booths 4513 and 6117.
Read more: VPIphotonics and CST partner for design automation of integrated photonic circuits
CHATSWORTH, CA – March 13, 2018 – NEO Tech, a leading provider of manufacturing technology and supply chain solutions for brand name OEMs in the industrial, medical and aerospace & defense markets, announces that it recently produced and published new and expanded guidelines for the manufacture of Low-Temperature Co-fired Ceramic (LTCC) and Aluminum Nitride (AlN) packaging solutions.
Master Bond is pleased to announce that the following epoxy compounds, EP17HTDA-1, EP21TDCHT, EP33, EP46HT-1AO, Supreme 11AOHT and Supreme 12AOHT-LO have passed MIL-STD-883J section 3.5.2., the subsection of the United States Military Standards set by the U.S. Department of Defense that refers to the thermal stability of a material.
Read more: 6 Master Bond Epoxy Adhesives Tested and Approved for MIL-STD-883J for Thermal Stability