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  • Thermal Vias are Ineffective. Here’s Why.

    Thermal Vias are Ineffective. Here’s Why.

    Adding thermal vias can take up valuable board space with little benefit.
      READ MORE...

  • Connecting the Industry, from Boards to Assemblies

    Connecting the Industry, from Boards to Assemblies

    HDP is embarking on new rounds of evaluations of laminates and lead-free solders.
      READ MORE...

  • Exploring the Impact of AI

    Exploring the Impact of AI

    A special panel discusses the growth of AI tools and its possible effects on the industry.
      READ MORE...

  • A Journey in Rigid-Flex Design

    A Journey in Rigid-Flex Design

    Overcoming the challenges of rigid-flex designs can be incredibly rewarding.
      READ MORE...

  • Creating the Ultra Library

    Creating the Ultra Library

    Building and maintaining what's said to be the world's largest CAD database requires strong relationships.
      READ MORE...

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2013 Issues

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Category: 2013 Issues

July 2013 cover

 

FEATURES

Design Planning
A Lean NPI Journey
A design bureau/EMS explains its implementation of Lean NPI, which relies on concurrent DfM analysis using vendor-supplied rule sets during PCB layout and improved data transfer.
by Randy Holt

Flex Circuits
Connecting Flex Layers Using Conductive Paste
A new flexible printed circuit method, called paste via, uses no copper plating and reduces board thickness by nearly 30%.
by Mike Buetow

 

FIRST PERSON

 

MONEY MATTERS

  • ROI
    Talent over tools.
    Peter Bigelow

 

TECH TALK

  • On the Forefront
    Next-gen packaging.
    E. Jan Vargerman

  • Designer’s Notebook
    Overcoming impedance discontinuities.
    Charles Pfeil

  • Flexperts
    Bonding stiffeners.
    Mark Finstad

  • Technical Abstracts
    In case you missed it.

Details
Category: 2013 Issues

May 2013 cover

 

FEATURES

Design Hall of Fame
CAD Pioneers Lead Latest Hall Inductees
The father of the gridless router. The largest seller of CAD seats. A leading inventor of team-based design. The foremost signal integrity guru. These are the four latest inductees to the Dieter W. Bergman PCB Design Hall of Fame.
by Mike Buetow

Data Transfer
IPC-2581 Consortium Update
The consortium is on track to extend the standard to enable build-intent collaboration between PCB manufacturers and design houses before layout begins.
by Hemant Shah

Quality Assurance
Using Forensics to Improve PCB Design and Assembly
Where AOI and conventional x-ray peak, other methods can hone in on nettlesome defects.
by Zulki Khan

ESD
Static Control Standards: An Annual Progress Report
From components to wrist straps, a look at more than 60 documents that make up ESD control programs.
by The ESD Association

 

FIRST PERSON

 

MONEY MATTERS

 

TECH TALK

  • On the Forefront
    New life in Japan?
    E. Jan Vargerman

  • Designer’s Notebook
    Filling the roster.
    W. Scott Fillebrown

  • In Flex
    The power of polyimide.
    Dale Wesselmann

  • Technical Abstracts
    In case you missed it.

Details
Category: 2013 Issues

May 2013 cover

 

FEATURES

PCB Layout
Will a Via Fit in Between?
BGAs have never been easy to route, but with 0.3mm versions coming, via-in-pad becomes a consideration.
by Duane Benson

Thermal Management
Cool Runnings
The ongoing push to integrate mechanical and electrical design has now extended to electronics cooling simulation.
by Mike Buetow

 

FIRST PERSON

 

MONEY MATTERS

  • ROI
    Rigid-flex.
    Peter Bigelow

 

TECH TALK

  • Designer’s Notebook
    Simulation accuracy.
    Patrick Carrier

  • The Flexperts
    Sticky situations.
    Mark Verbrugge

  • Tech Tips
    ‘Board’ talk.
    Robert Dervaes

  • Technical Abstracts
    In case you missed it.

Details
Category: 2013 Issues

April 2013 cover

 

FEATURES

Schematic Design
Advanced Block Organization in Schematic Design and Layout
Designs using blocks are much easier to check and maintain, saving precious design time. A lesser-known hierarchical capability called the virtual block is especially useful for smaller schematics.
by Abby Monaco

EMS Top 50
Bend, Don’t Break
If the EMS market in 2012 were a movie, it would have been the good (Nam Tai), the bad (the effects of RIM) and the ugly (Elcoteq). But most of the world’s 50 largest contract assemblers absorbed the blows from shrinking PC and cellphone margins and set their sights on the more profitable (if smaller) automotive and industrial sectors.
by Mike Buetow

ESD Basics
Managing Your ESD Program
Enjoy all the software tools, but don’t forget the procedures.
by The ESD Association

FIRST PERSON

 

MONEY MATTERS

  • ROI
    Incorporating new technology.
    Peter Bigelow

  • Focus on Business
    Relationship make or breaks.
    Susan Mucha

 

TECH TALK

  • Designer’s Notebook
    Design for test.
    W. Scott Fillebrown

  • Final Finishes
    Microetch, major player.
    Lenora Toscano

  • In Flex
    Flex circuit integration.
    Dale Wesselmann

  • Solar Technologies
    Dual print processes.
    Tom Falcon

  • Technical Abstracts
    In case you missed it.

Details
Category: 2013 Issues

March 2013 cover

 

FEATURES

CircuitHub
In Search of the Designer’s Holy Grail
The latest in a yearlong PCD&F series highlighting promising new enterprises in printed circuit board design looks at startup CircuitHub’s user-driven parts library.
by Mike Buetow

ESD Basics
The ‘Simple’ Problem
“Does my process generate an electrostatic charge, and if so, how much?” A simple “yes or no” answer is rare.
by The ESD Association

Apex Expo Recap
Let’s Get Small
At IPC Apex Expo this year, small was big. Benchtop was in and integration was all the rage at the annual North American trade show.
by Mike Buetow

Cover Story
Bridging Technology between Conventional 3D and TSV 3D Stacking
Two new multi-die DRAM packages have thin profiles and minimize wirebond length.
by  Belgacem Haba, Ph.D.

FIRST PERSON

  • Caveat Lector
    Acquiring minds.
    Mike Buetow

  • Talking Heads
    Gary Ferrari and the IPC-2221B.
    Mike Buetow

  • Talking Heads
    EMS Business on Block, Woods Still Sees Bright Side.
    Mike Buetow

 

MONEY MATTERS

  • ROI
    I will, I promise.
    Peter Bigelow

 

TECH TALK

  • Designer’s Notebook
    High speeds, small boards.
    Randall Myers

  • The Flexperts
    Going for gold.
    Mark Finstad

  • Technical Abstracts
    In case you missed it.

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