February 2013 cover

 

FEATURES

Signal Integrity
Addressing ‘Power-Aware’ Challenges of Memory Interface Designs
Memory interfaces are challenging signal integrity engineers from the chip level to the package, to the board, and across multiple boards. As the latest DDR3 and DDR4 speeds support multi-gigabit parallel bus interfaces with voltage swings smaller than previous generation interfaces, there is no room for error in any modern memory interface design. The combination of complete model libraries, advanced tools and engineering expertise addresses modern buses and data rates.
by Ken Willis and Brad Brim

Cover Story
Lead-Free Assembly Design for Manufacturability Considerations
The changeover to lead-free has brought with it serious implications for many key design rules. A look at the system-level management requirements and key DfM elements shown to improve overall yield, quality and reliability of high-complexity, high-reliability hardware.
by Matt Kelly and Mark Hoffmeyer, PH.D.

Quality Assurance
Availability Index and Minimized Reliability Costs

A model for quantifying how the total cost of improving and maintaining reliability can be minimized, and the relationship of that minimized cost to the availability index.
by Ephraim Suhir, Ph.D., and Laurent Bechou, PH.D.

ESD Basics
How Much Protection Is Enough?
Five questions to ask concerning ESD protection.
by The ESD Association

FIRST PERSON

 

MONEY MATTERS

  • ROI
    The great equalizer.
    Peter Bigelow

  • Focus on Business
    Evaluating technology improvements.
    Susan Mucha

 

TECH TALK

  • Designer’s Notebook
    Footprints' accuracy.
    W. Scott Fillebrown

  • In Flex
    Reducing flex assembly thickness.
    Dale Wesselmann

  • Tech Tips
    Solvent approval.
    Brian Ellis

  • Technical Abstracts
    In case you missed it.

January 2013 cover

 

FEATURES

Upverter
Designing Hardware in the Cloud
A startup company leveraging online collaborative tools to perform printed circuit design using a web browser and, in doing so, driving what it says is the first real technology transformation since Windows.
by Mike Buetow

Thermal Management
Direct Thermal Exchange and Its Impact on LED Heat Removal
A cutting-edge PCB construction methodology for highly-efficient heat removal or thermal dissipation creates a direct thermal path conduction capability and reduces LED junction temperature far more efficiently when compared to traditional FR-4, metal core or aluminum PCB constructions.
by Pratish Patel

High-Speed Backplanes
Predictability and Efficient Initial Backplane PCB Fabrication

The total signal loss is the combination of the losses by the conductor and dielectric laminate, and a successful design requires understanding SI design and low-loss material properties.
by Carl F. Hornig

Moisture Protection
Influences on Barrier Performance of UV/EB Cured Polymers.
by Joshua M. Oliver and Dale S. Babcock

 

FIRST PERSON

Caveat Lecto

Let’s get small.

  • Mike Buetow

 

TECH TALK

  • On the Forefront
    25 and counting.
    E. Jan Vardaman

  • Designer’s Notebook
    Stifling emissions.
    Patrick Carrier

  • ESD Basics
    Getting the Most from ESD Standards.
    The ESD Association

  • The Flexperts
    How many layers?
    Mark Verbrugge

  • Moisture Protection
    Influences on Barrier Performance of UV/EB Cured Polymers
    Joshua M. Oliver and Dale S. Babcock

  • Technical Abstracts
    In case you missed it.

Page 3 of 3