A Lean NPI Journey
A design bureau/EMS explains its implementation of Lean NPI, which relies on concurrent DfM analysis using vendor-supplied rule sets during PCB layout and improved data transfer.
by Randy Holt
Connecting Flex Layers Using Conductive Paste
A new flexible printed circuit method, called paste via, uses no copper plating and reduces board thickness by nearly 30%.
by Mike Buetow
On the Forefront
E. Jan Vargerman
Overcoming impedance discontinuities.
In case you missed it.