March 2013 cover



In Search of the Designer’s Holy Grail
The latest in a yearlong PCD&F series highlighting promising new enterprises in printed circuit board design looks at startup CircuitHub’s user-driven parts library.
by Mike Buetow

ESD Basics
The ‘Simple’ Problem
“Does my process generate an electrostatic charge, and if so, how much?” A simple “yes or no” answer is rare.
by The ESD Association

Apex Expo Recap
Let’s Get Small
At IPC Apex Expo this year, small was big. Benchtop was in and integration was all the rage at the annual North American trade show.
by Mike Buetow

Cover Story
Bridging Technology between Conventional 3D and TSV 3D Stacking

Two new multi-die DRAM packages have thin profiles and minimize wirebond length.
by  Belgacem Haba, Ph.D.


  • Caveat Lector
    Acquiring minds.
    Mike Buetow

  • Talking Heads
    Gary Ferrari and the IPC-2221B.
    Mike Buetow

  • Talking Heads
    EMS Business on Block, Woods Still Sees Bright Side.
    Mike Buetow



  • ROI
    I will, I promise.
    Peter Bigelow



  • Designer’s Notebook
    High speeds, small boards.
    Randall Myers

  • The Flexperts
    Going for gold.
    Mark Finstad

  • Technical Abstracts
    In case you missed it.

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