May 2012



Integrated 3D Analysis
Modeling 3D Effects of Signal Integrity
Demand for increasingly fast computation and information transmission continues to rise, with a substantial number of designs operating at multiple Gbps range. Advanced memory designs are moving data at 10 Gbps, and the latest SerDes communication standard is reaching toward 30 Gbps. Understanding the impacts from 3D structures on signal interconnects is important, but knowing whether there is a design problem is not enough. Instead, designers must know how much the effect could be and if a design can still work without significant modification.
by Dr. Zhen Mu

Design Implementation
Key Rules for Design for Excellence
Ample scientific work indicates that 75% to 85% of the cost of an electronic product is determined in the design phase. As the design process advances, the window of opportunity to introduce changes becomes smaller, and the cost of introducing change grows, in some cases exponentially. DfX can mitigate those costs, but only if properly implemented.
by Arbel Nissan

Mixed Signals
For designers, 2012 looks a lot like 2011, according to the results of our annual Designers’ Salary Survey. Veterans dominate the scene, and most of them are worked hard, but well-compensated for their efforts.
by Chelsey Drysdale






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