The Implementation of Via-in-Pad Interconnects to Increase PCB Circuit Density
Filled via-in-pad processes are a way to achieve an intermediate density increase for a minimal additional cost.
by Ishtiaq Safdar and Faisal Ahmed
Copper Via Fill - A Solution for HDI Via-in-Pad
Via fill for via-in-pad designs improves manufacturability from board fab through assembly.
by Chrys Shea and David Ormerod
R&D Needs for Packaging
WLPs may be the answer to the widening gap between device cost and packaging cost.
by Joe Adam
Ink Jet Printing
Ink Jet Printing for High-Frequency Electronic Applications
Nanoparticle inks and drop-on-demand ink jet printers offer a unique opportunity to generate fine-line additive circuits on flexible, three-dimensional substrates.
by John B. Blum
Flex Circuit Manufacturing
Screen Printing for High-Density Flexible Electronics
New paste materials and advances in screen-printing equipment create a flexible opportunity.
by Robert Turunen, Masafumi Nakayama and Dominique Numakura
POINT OF VIEW
Revitalizing the brand.
When compliance to design and quality standards for outsourced materials comes into question.
Signal integrity modeling, simulation and measurements can demand frequent examination of the PCB database.
Dr. Abe Riazi
Meeting the objective of a PTH metallization requires the deposition of a continous copper or conductive layer.
The Signal Doctor
Using sheet resistance as a metric can help you calibrate your intuition, even on structures such as vias.
Dr. Eric Bogatin
Off the Shelf