October 2007 cover


Via-in-Pad Design
The Implementation of Via-in-Pad Interconnects to Increase PCB Circuit Density
Filled via-in-pad processes are a way to achieve an intermediate density increase for a minimal additional cost.
by Ishtiaq Safdar and Faisal Ahmed

Via-in-Pad Fabrication
Copper Via Fill - A Solution for HDI Via-in-Pad
Via fill for via-in-pad designs improves manufacturability from board fab through assembly.
by Chrys Shea and David Ormerod

Packaging Roadmap
R&D Needs for Packaging
WLPs may be the answer to the widening gap between device cost and packaging cost.
by Joe Adam

Ink Jet Printing
Ink Jet Printing for High-Frequency Electronic Applications
Nanoparticle inks and drop-on-demand ink jet printers offer a unique opportunity to generate fine-line additive circuits on flexible, three-dimensional substrates.
by John B. Blum

Flex Circuit Manufacturing
Screen Printing for High-Density Flexible Electronics
New paste materials and advances in screen-printing equipment create a flexible opportunity.
by Robert Turunen, Masafumi Nakayama and Dominique Numakura



Our Line
Revitalizing the brand.
Kathy Nargi-Toth

When compliance to design and quality standards for outsourced materials comes into question.
Peter Bigelow

Interconnect Strategies
Signal integrity modeling, simulation and measurements can demand frequent examination of the PCB database.
Dr. Abe Riazi

Positive Plating
Meeting the objective of a PTH metallization requires the deposition of a continous copper or conductive layer.
Michael Carano

The Signal Doctor
Using sheet resistance as a metric can help you calibrate your intuition, even on structures such as vias.
Dr. Eric Bogatin



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