July 2007 cover


High-Speed Design
Modeling Issues in High-Speed Simulation
High frequency digital signals require complex models to accurately simulate the signal's path.
by Steve Kaufer

System Design
The Need for PCB Driven I/O Planning
Collaborative tools bring chip, package and PCB designer together to improve the system design process.
by Joel McGrath

Conductor Modeling
Modeling Frequency-Dependent Conductor Losses in Serial Data Channel Interconnects - Part 1
Roughness on the large conductor surfaces of a PCB can increase the interconnect loss as much as 50%.
by Yuriy Shlepnev

Emerging Technology
Laser Micromachining of Nanocomposite-Based Flexible Embedded Capacitors
Nanomaterials provide the basis for flexible embedded components that meet the demands of new low-cost, large-area, flexible and lightweight devices.
by Rabindra N. Das, Frank D. Egitto, John M. Lauffer and Voya R. Markovich

Technology Forecast
The Organic Interconnect Roadmap
The printed circuit board will continue to be the "work-horse" of interconnection technology.
by Jack Fisher

From the Field
Surpassing Customer Expectations
Creating a company ethic that accepts nothing less than excellence in customer service can be a compelling core value to create a unique and successful niche.
by Kathy Nargi-Toth


Our Line
New money.
Kathy Nargi-Toth

When hiring, the right attitude and some basic skills are a sound foundation to build on.
Peter Bigelow

EMC for the Real World
EMI/EMC concerns for high-speed differential signals.
Dr. Bruce Archambeault

The Flex Market
March PCB production in Asia: a return to growth?
Dominique Numakura

The Signal Doctor
The properties of inductance are confusing but don't require a lot of intergrals to calculate.
Dr. Eric Bogatin



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