Has the Copper Interconnect Hit Its Speed Limit?
The silicon may do all the work, but it's up to the interconnect to minimize the hit to size, weight, cost and signal quality. A look at how traditional copper lines are finding new life at previously unfathomable speeds.
by Dr. Eric Bogatin
Resolving Component Polarity Problems
Knowing the rotations for each component type can compensate for inconsistencies in orientation between library geometries and component reels.
by Jack C. Olson
Design Rules for LDI
What Designers Should Know About LDI
Laser direct imaging eliminates phototools and tightens design tolerances. The good designer will use these guidelines to take full advantage.
by Brewster Barclay
Methodology for High Aspect Ratio Pulse Plating
Periodic reverse pulse tanks, once seen as a current density capacity enhancement for standard boards, are turning out significantly better results versus DC plating.
by Robert D. Edwards
2004 PCD&M Buyers' Guide
POINT OF VIEW
The art of staying successful.
Stupid and bad and inspiring and good.
Setting the standards for embedded passive materials and boards.
The great data race is on.
The Flex Market
The expanding material shortage.
You're never too old for an education.
Is it unpatriotic to buy boards offshore?
Off The Shelf