SANTA CLARA, CA – UP Media Group is seeking abstracts for PCB West 2013, to be held here Sept. 24-26.
The event includes a three-day technical conference and one-day exhibition to be held at the Santa Clara Convention Center.
PCB West annually provides a conference and exhibition focused on the design and manufacture of PCBs, HDI, electronics assembly and circuit board test. The September 2012 event attracted more than 2,000 registrants and 1,400 attendees for the actual event.
Papers and presentations of the following durations are sought for the technical conference: one-hour lectures and presentations; two-hour workshops, and half-day (3.5 hours) seminars.
Suggested paper and presentation topics include LED design and assembly; RF and microwave design; high speed, high frequency and signal integrity; component placement; EMI/EMC analysis; thermal analysis; lead-free processes; environmental legislation (REACH, RoHS, etc.) and its effects; packaging design; mixed-signal design; area arrays; FPGA design and implementation; embedded passives and active devices; flexible circuitry; HDI design and technologies; PCB design/layout basics; component library creation and management; design for manufacture, test and assembly; electronics assembly; soldering; component placement; screen and stencil printing; PCB fabrication; surface finishes; new component packaging; industry forecasts, and business and supply chain issues.
If selected, final papers and presentations will be due Aug. 14.
PRINTED CIRCUIT DESIGN & FAB and CIRCUITS ASSEMBLY magazines are media partners for the event.