CUPERTINO, CA – Apple has reportedly decided to reduce rigid-flexible PCBs in its upcoming OLED iPhones, replacing them with multi-flexible PCBs, according to r... Read More...
REDWOOD CITY, CA -- Sales of software for printed circuit board and multichip module design rose 2.4% year-over-year to $241.1 million in the fourth quarter. Read More...
COLD SPRING HARBOR, NY -- ZDT topped Nippon Mektron (Mektec) as the world's largest printed circuit fabricator in 2017. Read More...
WASHINGTON — The 90-day moving average sales of semiconductors worldwide reached $36.8 billion in February, up 21% from 2017. Read More...
BANNOCKBURN, IL – Total North American printed circuit board shipments in February were up 8.8% year-over-year, says IPC. Year to date, shipments were up 9.3% c... Read More...
BANNOCKBURN, IL — IPC's first-quarter global electronics industry survey shows worldwide business environment scores as positive and strengthening. Read More...
OULU, FINLAND -- Aspocomp Group has acquired the Oulu facility that it has been leasing for PCB production. Read More...
HONG KONG – Kingboard Chemical Holdings reported full-year 2017 revenue of $5.5 billion, up 20.5% year-over-year. Read More...
MILPITAS, CA – North America-based manufacturers of semiconductor equipment posted $2.41 billion in billings worldwide in February (three-month average basis), ... Read More...
HAMPSHIRE, UK – Connected clothing will become a $1 billion industry in 2020, the fastest growing wearables sector, growing at a 102% CAGR over the next two yea... Read More...
SAN JOSE -- Flex has entered into an agreement with Multi-Fineline Electronix (M-Flex), a wholly-owned subsidiary of Suzhou Dongshan Precision Manufacturing, to... Read More...
BANNOCKBURN, IL -- IPC is warning that higher tariffs on electronics imported from China will increase costs to US businesses and consumers while not making a d... Read More...
SCHRAMBERG, GERMANY – Schweizer Electronic posted sales of €120.9 million (US$148.9M) in 2017, up 4.1% year-over-year. Read More...
TAIPEI, TAIWAN – The top three server DRAM suppliers are progressing toward the specification of 32GB RDIMM, and first quarter quotes offered by server DRAM sup... Read More...
SCOTTSDALE, AZ -- IC Insights raised its 2018 forecast for memory chips on the strength of average selling prices. Read More...
Advancements in electronics now extend to the bathroom; in particular, the toilet. Read More...
The workstation class all-in-one machine has some serious horsepower. Read More...
Expect ultra-thin/coreless package substrate technologies, thinner dies – and new assembly techniques. Read More...
The evolution from Gerber to Industry 4.0 is well on its way. Read More...
By controlling the geometry, we can control reflections. But the rules of conduction are the same. Read More...
In PCB transmission lines, a correct design can render leakage negligible. Read More...
Nano-tech 2018 was held at Tokyo Big Sight Feb. 14-16. Read More...
IM series high-frequency laminates are passive intermodulation (PIM) performing version of AD300D, AD255C, and DiClad 880 antenna grade laminates. Read More...
AD300D 4th gen. commercial microwave and RF laminate material extends capabilities of AD300 product. Read More...
BR series raised element through-hole current sense resisters have 1W, 3W, and 5W power ratings. Read More...
CU4000 and CU4000 LoPro foils are sheeted foil options for designers looking for foil lamination builds. Read More...
RO4450T bonding materials are 3.2-3.3Dk, low loss, spread-glass reinforced, and ceramic-filled. Read More...
RO4835T laminates are offered in 2.5 mil, 3 mil and 4 mil core thicknesses, are 3.3 Dk, low loss, spread-glass reinforced, ceramic-filled thermoset materials. Read More...
Sherlock automated design analysis software v. 5.4 includes temperature-based FEA, materials library expansion, component failure modes, and a Sqlite parts libr... Read More...
Arlon raPId polyimide substrates are for streamlining manufacturing and improving performance of flexible heater applications. Read More...
XYR-03-01 alignment stage is a high-resolution, high-repeatability x-y-theta stage for wafer alignment, semiconductor handling, laser cutting and drilling. Read More...
Etchable gold thick film process for high-definition thick film circuitry is an alternative to thin films. Read More...
Neoganth W Pre Dip is for desmear and metallization (PTH) process step for fine-line HDI and package substrate applications. Read More...
V-One automated drilling attachment mounts directly on V-One PCB printer. Read More...
Library.io creates component outlines for Autodesk Eagle and 3D models that can be used with Fusion360 3D CAD (http://www.pcdandf.com/pcdesign/menu-research/cad... Read More...
FH63 series rugged FPC/FFC connectors offer high-heat resistance for harsh environment applications. Read More...