NEWS

Apple to Reduce Rigid-Flex, Replace with Multi-Flex PCBs in Upcoming iPhone

Apple to Reduce Rigid-Flex, Replace with Multi-Flex PCBs in Upcoming iPhone

04 April 2018

CUPERTINO, CA – Apple has reportedly decided to reduce rigid-flexible PCBs in its upcoming OLED iPhones, replacing them with multi-flexible PCBs, according to r...  Read More...

PCB Design Software Sales Up in Q4, Continuing Long Rally

PCB Design Software Sales Up in Q4, Continuing Long Rally

04 April 2018

REDWOOD CITY, CA -- Sales of software for printed circuit board and multichip module design rose 2.4% year-over-year to $241.1 million in the fourth quarter.  Read More...

ZDT, Mektec Top Prismark List of Top PCB Fabricators in 2017

ZDT, Mektec Top Prismark List of Top PCB Fabricators in 2017

03 April 2018

COLD SPRING HARBOR, NY -- ZDT topped Nippon Mektron (Mektec) as the world's largest printed circuit fabricator in 2017.  Read More...

Semiconductor Sales Rise 21% YoY In February

Semiconductor Sales Rise 21% YoY In February

03 April 2018

WASHINGTON — The 90-day moving average sales of semiconductors worldwide reached $36.8 billion in February, up 21% from 2017.  Read More...

Feb. N. American PCB Shipments Up 9%

Feb. N. American PCB Shipments Up 9%

02 April 2018

BANNOCKBURN, IL – Total North American printed circuit board shipments in February were up 8.8% year-over-year, says IPC. Year to date, shipments were up 9.3% c...  Read More...

Electronics Industry Growth Projected to Top 2017, IPC Says

Electronics Industry Growth Projected to Top 2017, IPC Says

02 April 2018

BANNOCKBURN, IL — IPC's first-quarter global electronics industry survey shows worldwide business environment scores as positive and strengthening.  Read More...

Aspocomp Buys PCB Plant -- But Won't Need to Relocate

Aspocomp Buys PCB Plant -- But Won't Need to Relocate

29 March 2018

OULU, FINLAND -- Aspocomp Group has acquired the Oulu facility that it has been leasing for PCB production.  Read More...

Kingboard Posts Fiscal 2017 Revenue Up Nearly 21%

Kingboard Posts Fiscal 2017 Revenue Up Nearly 21%

27 March 2018

HONG KONG – Kingboard Chemical Holdings reported full-year 2017 revenue of $5.5 billion, up 20.5% year-over-year.  Read More...

February N. American Semi Equipment Billings Up 22%

February N. American Semi Equipment Billings Up 22%

27 March 2018

MILPITAS, CA – North America-based manufacturers of semiconductor equipment posted $2.41 billion in billings worldwide in February (three-month average basis), ...  Read More...

Connected Clothing to Grow at 102% CAGR to Become $1B Industry in 2020

Connected Clothing to Grow at 102% CAGR to Become $1B Industry in 2020

27 March 2018

HAMPSHIRE, UK – Connected clothing will become a $1 billion industry in 2020, the fastest growing wearables sector, growing at a 102% CAGR over the next two yea...  Read More...

MFlex Parent Co. to Acquire Multek's PCB Operations in China

MFlex Parent Co. to Acquire Multek's PCB Operations in China

27 March 2018

SAN JOSE -- Flex has entered into an agreement with Multi-Fineline Electronix (M-Flex), a wholly-owned subsidiary of Suzhou Dongshan Precision Manufacturing, to...  Read More...

IPC Urges Trump Administration to Take Measured Approach in Levying Higher Tariffs on Electronics from China

IPC Urges Trump Administration to Take Measured Approach in Levying Higher Tariffs on Electronics from China

23 March 2018

BANNOCKBURN, IL -- IPC is warning that higher tariffs on electronics imported from China will increase costs to US businesses and consumers while not making a d...  Read More...

Schweizer Electronic Reports Sales Up 4% in 2017 to $149M

Schweizer Electronic Reports Sales Up 4% in 2017 to $149M

22 March 2018

SCHRAMBERG, GERMANY – Schweizer Electronic posted sales of €120.9 million (US$148.9M) in 2017, up 4.1% year-over-year.  Read More...

Q1 Server DRAM Supplier Quotes to Grow 4%

Q1 Server DRAM Supplier Quotes to Grow 4%

22 March 2018

TAIPEI, TAIWAN – The top three server DRAM suppliers are progressing toward the specification of 32GB RDIMM, and first quarter quotes offered by server DRAM sup...  Read More...

IC Insights Nearly Doubles 2018 IC Market Forecast

IC Insights Nearly Doubles 2018 IC Market Forecast

23 March 2018

SCOTTSDALE, AZ -- IC Insights raised its 2018 forecast for memory chips on the strength of average selling prices.  Read More...

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FEATURES

Consumer Electronics in the Bathroom

Consumer Electronics in the Bathroom

Advancements in electronics now extend to the bathroom; in particular, the toilet.  Read More...

Apple iMac Pro Teardown

Apple iMac Pro Teardown

The workstation class all-in-one machine has some serious horsepower.  Read More...

The Next PC Evolution Will Bring a Richer User Experience

The Next PC Evolution Will Bring a Richer User Experience

Expect ultra-thin/coreless package substrate technologies, thinner dies – and new assembly techniques.  Read More...

Why IPC-2581 is the CAD Data Exchange Format of Today – and Tomorrow

Why IPC-2581 is the CAD Data Exchange Format of Today – and Tomorrow

The evolution from Gerber to Industry 4.0 is well on its way.  Read More...

Are Transmission Line Signals in Printed Circuit Boards Different from Conductor Signals?

Are Transmission Line Signals in Printed Circuit Boards Different from Conductor Signals?

By controlling the geometry, we can control reflections. But the rules of conduction are the same.  Read More...

The Layout of Fast Logic on Printed Circuit Boards

The Layout of Fast Logic on Printed Circuit Boards

In PCB transmission lines, a correct design can render leakage negligible.  Read More...

Nano Tech 2018 and Printable Electronics

Nano Tech 2018 and Printable Electronics

Nano-tech 2018 was held at Tokyo Big Sight Feb. 14-16.  Read More...

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PRODUCTS

Rogers Rolls Out IM Series High-Frequency Laminates

Rogers Rolls Out IM Series High-Frequency Laminates

IM series high-frequency laminates are passive intermodulation (PIM) performing version of AD300D, AD255C, and DiClad 880 antenna grade laminates.  Read More...

Rogers Introduces AD300D RF Laminates

Rogers Introduces AD300D RF Laminates

AD300D 4th gen. commercial microwave and RF laminate material extends capabilities of AD300 product.  Read More...

Stackpole Electronics Offers BR Series Current Sense Resistors

Stackpole Electronics Offers BR Series Current Sense Resistors

BR series raised element through-hole current sense resisters have 1W, 3W, and 5W power ratings.  Read More...

Rogers Releases CU4000 LoPro Foils

Rogers Releases CU4000 LoPro Foils

CU4000 and CU4000 LoPro foils are sheeted foil options for designers looking for foil lamination builds.  Read More...

Rogers Debuts RO4450T Bonding Materials

Rogers Debuts RO4450T Bonding Materials

RO4450T bonding materials are 3.2-3.3Dk, low loss, spread-glass reinforced, and ceramic-filled.  Read More...

Rogers Introduces RO4835T Laminates

Rogers Introduces RO4835T Laminates

RO4835T laminates are offered in 2.5 mil, 3 mil and 4 mil core thicknesses, are 3.3 Dk, low loss, spread-glass reinforced, ceramic-filled thermoset materials.  Read More...

DfR Solutions Rolls Out Sherlock Automated Design Analysis Software v. 5.4

DfR Solutions Rolls Out Sherlock Automated Design Analysis Software v. 5.4

Sherlock automated design analysis software v. 5.4 includes temperature-based FEA, materials library expansion, component failure modes, and a Sqlite parts libr...  Read More...

Rogers Unveils Arlon raPld Substrates

Rogers Unveils Arlon raPld Substrates

Arlon raPId polyimide substrates are for streamlining manufacturing and improving performance of flexible heater applications.  Read More...

Optimal Engineering Rolls Out XYR-03-01 Alignment Stage

Optimal Engineering Rolls Out XYR-03-01 Alignment Stage

XYR-03-01 alignment stage is a high-resolution, high-repeatability x-y-theta stage for wafer alignment, semiconductor handling, laser cutting and drilling.  Read More...

Remtec Offers HDTF Substrates

Remtec Offers HDTF Substrates

HDTF substrates can incorporate conductor multilayers.  Read More...

Remtec Rolls Out Etchable Gold Thick Film Process

Remtec Rolls Out Etchable Gold Thick Film Process

Etchable gold thick film process for high-definition thick film circuitry is an alternative to thin films.  Read More...

Atotech Debuts Neoganth W Horizontal Activator Pre Dip

Atotech Debuts Neoganth W Horizontal Activator Pre Dip

Neoganth W Pre Dip is for desmear and metallization (PTH) process step for fine-line HDI and package substrate applications.  Read More...

Voltera Debuts V-One Drill

Voltera Debuts V-One Drill

V-One automated drilling attachment mounts directly on V-One PCB printer.  Read More...

Autodesk Offers Library.io Component Outline Tool

Autodesk Offers Library.io Component Outline Tool

Library.io creates component outlines for Autodesk Eagle and 3D models that can be used with Fusion360 3D CAD (http://www.pcdandf.com/pcdesign/menu-research/cad...  Read More...

Hirose Offers FH63 Series Connectors

Hirose Offers FH63 Series Connectors

FH63 series rugged FPC/FFC connectors offer high-heat resistance for harsh environment applications.  Read More...

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