| Hitachi Chemical Rolls Out MCL-E-800G/MCL-E-705G Interposer Laminates |
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| Written by Mike Buetow | |||
| Monday, 25 June 2012 14:31 | |||
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MCL-E-800G/MCL-E-705G series semiconductor package substrate materials are halogen-free, high Tg, low thermal expansion. 800G series has a CTE of 2.8ppm/℃, and is for use in package-o-package (PoP) and FC-BGA interposer substrates. MCL-E-705G series is suitable for multi-tiered structures such as stacked semiconductor packages. Hitachi Chemical, www.hitachi-chem.co.jp/english/index.html
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