| Hitachi Chemical Rolls Out MCL-E-800G/MCL-E-705G Interposer Laminates |
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| Monday, 25 June 2012 14:31 | |||
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MCL-E-800G/MCL-E-705G series semiconductor package substrate materials are halogen-free, high Tg, low thermal expansion. 800G series has a CTE of 2.8ppm/℃, and is for use in package-o-package (PoP) and FC-BGA interposer substrates. MCL-E-705G series is suitable for multi-tiered structures such as stacked semiconductor packages. Hitachi Chemical, www.hitachi-chem.co.jp/english/index.html
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ML605GTW4-UV NC laser drill features two high-energy UV laser oscillator heads. Uses 355nm wavelength suitable for drilling polyimide material/flexible substrates. Mitsubishi Electric, www.mitsubishielectric.co.jp
ML605GTW4-UV NC laser drill features two high-energy UV laser oscillator heads. Uses 355nm wavelength suitable for drilling polyimide material/flexible substrates. Mitsubishi Electric, www.mitsubishielectric.co.jp
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New Trends From JPCA Show 2013
The world’s largest electronics show for Electronics Packaging, Circuits and Assembling (the JPCA Show) was held at Tokyo Big Sight from June 5 through June 7. The following shows were held concurrently in the convention center: Large Electronics Show 2013, JIEP 2013 (Microelectronics Show), Jisso Protech 2013 and Monotsukuri Fiesta 2013. The electronics industry in Japan is suffering its worst slump in history. I was hoping to see some...
The world’s largest electronics show for Electronics Packaging, Circuits and Assembling (the JPCA Show) was held at Tokyo Big Sight from June 5 through June 7. The following shows were held concurrently in the convention center: Large Electronics Show 2013, JIEP 2013 (Microelectronics Show), Jisso Protech 2013 and Monotsukuri Fiesta 2013. The electronics industry in Japan is suffering its worst slump in history. I was hoping to see some...
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