| LED Manufacturing Investment Declines as Industry Contemplates Future Directions |
|
|
| Written by Tom Morrow | |||
| Friday, 18 January 2013 15:40 | |||
|
SAN JOSE -- Spending on LED fab manufacturing equipment will decline 9.2% in 2013 as the industry faces weak long-term demand and consolidates manufacturing capacity. According to the SEMI LED/Opto Fab Forecast, spending on LED fab manufacturing equipment will drop to $1.68 billion in 2013, down from $1.85 billion in 2012. Global LED manufacturing capacity will continue to grow this year, reaching an estimated 2.57 million 4-in. wafer equivalents, a 24% increase over 2012. The outlook for equipment spending in 2014 is currently projected at less than $1 billion, as manufacturers assess an uncertain competitive environment and potential alternative manufacturing strategies.
Figure 1. World LED capacity trend. (Source: SEMI Opto/LED Fab Forecast, Nov. 2012)
Among the reasons for weak long-term demand is the LED count per device is dropping fast and the long-life of LED-based lighting systems radically reduces the replacement lamp market. For LED manufacturers, average selling prices continue to drop, especially in high-growth mid- and low-power segments serving the lighting industry.
|
Design News
- Pakistan Hopes New Design Centers Will Aid Push into PCB Market
- PCB West Registration Open
- PCB West Technical Conference Announced
- iNEMI Seeks Participation on Implantable Device Project
- IPC-2581 Standard to be Circulated for Final Vote
- Vast Majority of Parts Placed are SMT, IPC Survey Finds
- Ansys Software Pirate Gets 12 Years
- DoD Seeks Public Input on Contract Obligations Concerning Fake Parts
- iNEMI Releases Counterfeit Parts Assessment
- Plexus Opens 2d Scotland Site
Market News
- Semi Fab Equipment Orders Up Sequentially
- Slow Growth Ahead for Electronics Industry, IPC Says
- US Mfg Orders Slide in April
- April Semi Sales Lag, Moderate Growth Ahead
- Semi Fab Expectations High for US
- Semi Fab Equipment Outlook Improving
- Q1 DRAM Revenue Rises 6% Sequentially
- IDC Downgrades PC Outlook
- Server Shipments Slow in Q1
- IDC Forecasts Tablet Shipments to Grow 58.7% in 2013
Fab News
- LG Innotek to Divest PCB Unit
- BOMcheck Reachs 1M RoHS and REACH Materials Declarations
- Lazer-Tech Acquires Sales Firm
- AT&S to Push into IC Substrate Market
- Partner Suggests More Acquisitions Ahead for Advanced Circuits
- Plasma Technology Workshop Set for Ontario
- Bare Board Market Forecast for 8% CAGR Through 2017
- GBM Expects Auto Sales to Drive New Growth
- New Fine-Line Etching Process Said to Eliminate H2O2
- RoHS2 Webcast Offered this Month
Products
ML605GTW4-UV NC laser drill features two high-energy UV laser oscillator heads. Uses 355nm wavelength suitable for drilling polyimide material/flexible substrates. Mitsubishi Electric, www.mitsubishielectric.co.jp
Features
The world’s largest electronics show for Electronics Packaging, Circuits and Assembling (the JPCA Show) was held at Tokyo Big Sight from June 5 through June 7. The following shows were held concurrently in the convention center: Large Electronics Show 2013, JIEP 2013 (Microelectronics Show), Jisso Protech 2013 and Monotsukuri Fiesta 2013. The electronics industry in Japan is suffering its worst slump in history. I was hoping to see some...
- Achieving Proper Placement of Passive Devices Used for Enet Signal Termination
- Hall of Inventors
- Using Forensics to Improve PCB Design and Assembly
- CAD Pioneers Lead Latest Hall Inductees
- Electrical Performance in a Thin Package
- Making PCB Design a Team Approach
- IPC-2581 Consortium Update
- ESD Standards: An Annual Progress Report
- Reinventing Japan
- The Manufacturing Spin


