January 2010 Issue Print E-mail
Friday, 01 January 2010 00:00

PCD&F January 2010 cover

FEATURES

  • CAM
    Improving Fabrication Yields
    A large portion of manufacturing yield is tied up in the CAM process, and these "fabrication planners" can make the difference between profits and losses. Plus: The designer's role.
    by Zulki Khan

  • EDA Tools For Today and Tomorrow
    'We Need to Facilitate Faster, Smarter Design'
    Leading design and layout tool suppliers talk about their software, designers' needs, the industry's biggest challenges, and why FPGAs could do for PCB designers what microprocessors did for their digital forerunners.
    by Pete Waddell

  • Design Tools
    Predicting PCB Density
    Comparing design data requirements to design resources can result in better electronic performance at a reduced cost. A density-predicting calculator is a tool that performs a tradeoff analysis at the feasibility stage, given the constraints of the assigned area.
    by Ruth Kastner and Eliahu Moshe

  • Productronica Recap
    Trading Up
    For the first time in 10 years, we saw the sun in Munich. Is it a sign of a new dawn for the industry? OK, no, but amid tepid expectations, Productronica turned out stronger than expected, again defying gravity and the pundits to remain the mother of all trade shows.
    by Mike Buetow

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Last Updated on Monday, 11 January 2010 18:46
 

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ANSYS Releases Ansoft Designer 6.0
Ansoft Designer 6.0 Solver on Demand technology analyzes signal-integrity, power-integrity and electromagnetic interference problems from a single schematic- and layout-based environment. Can access field and circuit simulation tools while designing electronic packages and PCBs early in the design cycle. Integrates HFSS 3-D electromagnetic field simulation software and HSPICE IC simulation. Can predict how high-frequency electromagnetic components affect ICs. Provides user interface to HSPICE with direct links to HFSS and access to the ANSYS QuickEye and VerifEye convolution and statistical...

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Features

In Case You Missed It
Component Layout“PCB Design and Assembly for Flip-Chip and Die Size CSP”Author: Vern Solberg; vsolberg123@aol.com.Abstract: This paper outlines the basic elements furnished in the newly released IPC-7094, Design and Assembly Process Implementation for Flip-Chip and Die Size Components, providing a comparison of existing and emerging wafer-level and chip-size package methodologies. The focus is on the effect of PCB design and assembly of bare die or die-size components in an uncased or...

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