Study: IC Package Pitch Headed Widely to 0.4mm Print E-mail
Written by Mike Buetow   
Monday, 09 September 2013 17:36

SAN JOSE, CA – A new study of trends in IC packaging says 0.5mm pitch will remain mainstream for years to come.

When comparing total packages, 0.4mm pitch will grow fastest, from 1.7% of the market in 2012 to 10.1% by 2017, New Venture Research says.

Nevertheless, 0.5mm pitch will remain the most common size used, growing from 37.3% in 2012 to 47.3% growth in 2017.

Growth is also seen for 0.3mm pitch, which will rise with an effective 0% share in 2012 to 4.9% in 2017.

Packages with pitches of 0.8mm, which made up 27.7% of the market in 2012, will fall to 17.9% to 2017. Other sizes forecast to fall in use include 0.65mm pitch(to 9% from 12.8%), 1.27mm pitch or greater (to 7.5% from 9.2%); 1mm pitch (to 3.1% from 9.6%); and 0.45mm (to 0.2% from 1.7%).

NVR's report is titled IC Package Pitch, Leadframe Plating, and Substrate Markets.

Tags: IC packaging, component package, substrate, PCB, electronics, semiconductor

Last Updated on Monday, 09 September 2013 17:54




CB Login



English French German Italian Portuguese Russian Spanish

Printed Circuit Design & Fab Magazine on Facebook