Semiconductor Manufacturing and Test Equipment (North America) Print E-mail
Written by SEMI   
Tuesday, 19 July 2011 19:58

Monthly report tracking billings and bookings (book-to-bill) worldwide of North American-headquartered manufacturers of equipment used to manufacture semiconductor devices (does not track billings and bookings of semiconductors). Categories covered include front-end (wafer processing/mask/reticle/wafer manufacturing/fab facilities) equipment and final manufacturing (assembly/packaging/test) equipment. Data are provided on a 90-day moving average basis. This is considered a leading indicator of future printed circuit board and electronics assembly orders.

 

Last Updated on Monday, 24 February 2014 16:19
 

Search

Search

Login

CB Login

Language

Language

English French German Italian Portuguese Russian Spanish
 


Printed Circuit Design & Fab Magazine on Facebook