| American Standard Circuits Issued Second US Patent |
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| Wednesday, 08 July 2009 15:12 | |||
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FRANKLIN PARK, IL – American Standard Circuits (ASC) has received its second patent from the US PTO. U.S. Patent 7,540,081 covers Thermasil Film, used to bond high- or low-frequency PCBs to metal heat sinks with thermally conducting, electrically insulating, silicone-based film. The film can be made in thickness measuring 3 mil to 25 mil, with thermal conductivity from 1.5 W/mK to 4.5 W/mK. ASC plans to license the technology.
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Ansoft Designer 6.0 Solver on Demand technology analyzes signal-integrity, power-integrity and electromagnetic interference problems from a single schematic- and layout-based environment. Can access field and circuit simulation tools while designing electronic packages and PCBs early in the design cycle. Integrates HFSS 3-D electromagnetic field simulation software and HSPICE IC simulation. Can predict how high-frequency electromagnetic components affect ICs. Provides user interface to HSPICE with direct links to HFSS and access to the ANSYS QuickEye and VerifEye convolution and statistical...
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Component Layout“PCB Design and Assembly for Flip-Chip and Die Size CSP”Author: Vern Solberg; vsolberg123@aol.com.Abstract: This paper outlines the basic elements furnished in the newly released IPC-7094, Design and Assembly Process Implementation for Flip-Chip and Die Size Components, providing a comparison of existing and emerging wafer-level and chip-size package methodologies. The focus is on the effect of PCB design and assembly of bare die or die-size components in an uncased or...
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