| Premier Farnell Offering $30K in Electronics Scholarships |
 |
 |
| Wednesday, 08 July 2009 09:14 | |||
|
LONDON -- Electronics distributor Premier Farnell is accepting scholarship applications from students worldwide who are registered in a full-time electrical and electronics engineering course in the 2009 entry year. The $30,000 in scholarship funds come from prize money that remained after a student division winner was not named for the 2008 Live EDGE Electronic Design Global Environment challenge. The scholarship awards will be evenly distributed between Asia, Europe and the Americas, allotting $10,000 for each region or four $2,500 individual scholarships per region. Scholarship information, including the application form and terms and conditions, are available on the element14 website. Applications will be accepted through Aug. 31 and winners will be announced Oct. 1. Applicants will be required to answer one of three questions. They can explain the importance of their electrical engineering degree in today and tomorrow’s society and how they plan in using it to better the environment. Alternatively, they can either explain how they feel electronics design will change in the coming years or what new technology will have the biggest impact on electronics in the near future. “Encouraging innovation and forward thinking among engineering students is paramount to the development and sustainability of future generations of design engineers,” said Harriet Green, chief executive of Premier Farnell. “The Live EDGE scholarship fund will help to encourage and develop 12 students enabling them to continue or start their education for the year to come. We are excited that through these scholarships we are able to support students as they strive to become leaders in critical environmental design practices.” Premier Farnell is the parent company of Farnell, Newark, Premier Electronics, Farnell-Newark CPC and MCM.
|
Design News
- PCB WEST 2010 Registration up 72%
- DfE Planning Can Save Millions
- Icahn Increases Mentor Stake to 15%
- CST to Host EMC System Design Webinars
- Mentor Narrows Q2 Loss on Higher Sales
- DKN Unveils Ultra-Thin Connectors for High-Density Flex Substrates
- Gore White Paper Discusses Cable System Selection
- Camstar Says License Revenue Strong
- Cadence Returns to Profitability in Q2
- NI Reports Stellar Q2; Record Year Forecast
Market News
- August Production Sees Strong Growth
- New US Export Control System Rules to Come Tuesday
- Semi Sales Up 37% YoY in August
- US GAO Report Spurs EPA Action on Electronics Recycling
- Rising Semi Inventories Not Cause for Concern
- Mistake Caused Lower Parts Outlook, ECA Says
- Semi Gear Demand Spikes in July
- EPA Head Singles Out E-Waste For Elimination
- Analyst: Has PCB Market Peaked?
- July Marks One Year of Continued Manufacturing Growth
Fab News
- BBG Makes Inc. 5000 List for the 4th Straight Time
- ChungHong to Raise Nearly $7M in Funds
- Nan Ya's Q3 Sales Up 5%
- Foxconn Q2 Profits Up 11%
- N.American PWB Orders Up 34%
- Cicor PCB Division Posts 27% H1 Revenue Increase
- Schweizer's H1 Sales Up 80% YoY
- 3CEMS Eyes Revenue Jump, Public Listing
- Agfa Says Higher PCB Film Demand
- Porat to Succeed Amit as Camtek CEO
Products
Sensor Products Introduces Tactilus Heat-Sink Analysis System
Tactilus heat-sink analysis system enables test and correction of surface contact and pressure distribution between the heat sink and its source. Can visualize actual contact forces and pressure distribution data on the components. As mounting screws between the CPU and the heat sink are torqued, it maps and measures the changing pressure distribution between the mating surfaces and displays it. Can be tested, manipulated, and repositioned in real-time. Provides pressure data needed for FEA simulation predictions. Is 0.015" thick; can be placed between the CPU and heat sink without affecting...
Tactilus heat-sink analysis system enables test and correction of surface contact and pressure distribution between the heat sink and its source. Can visualize actual contact forces and pressure distribution data on the components. As mounting screws between the CPU and the heat sink are torqued, it maps and measures the changing pressure distribution between the mating surfaces and displays it. Can be tested, manipulated, and repositioned in real-time. Provides pressure data needed for FEA simulation predictions. Is 0.015" thick; can be placed between the CPU and heat sink without affecting...
Sponsor Links
Need PCB prototypes fast?
Sunstone Circuits takes the pain out of prototyping! We are dedicated to making the online ordering of PCB prototypes simple, fast, and easy from quote to delivery. Quick access to our 24/7/365 customer service team and easy online order tracking takes the pain out of sourcing prototypes online.
Put us to the test - order Sunstone Circuits today!
Search
Search
Login
CB Login
Language
Language
Features
EMS’ Rude Awakening
Can high-mix, low-volume production succeed in China? You bet. In the 1970s, if you set up a contract manufacturing shop in a good location, customers eventually would walk through the doors. In the real world, things quickly changed for American companies, as OEMs, driven by maximizing shareholder value, searched for cheaper sources offshore. The first options were Hong Kong, Malaysia and Singapore. After prices increased in these countries, greener pastures were found in China....
Can high-mix, low-volume production succeed in China? You bet. In the 1970s, if you set up a contract manufacturing shop in a good location, customers eventually would walk through the doors. In the real world, things quickly changed for American companies, as OEMs, driven by maximizing shareholder value, searched for cheaper sources offshore. The first options were Hong Kong, Malaysia and Singapore. After prices increased in these countries, greener pastures were found in China....
Current Issue
Parts
Printed Circuit Design & Fab Magazine on Facebook