| Forecast: Handset Sales Up in Q3 |
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| Thursday, 02 July 2009 12:36 | |||
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TAIPEI, TAIWAN – There are only 175 shopping days until Christmas, but handset PCB makers are already ramping up for holiday sales increases. Compeq Manufacturing, Unitech Printed Circuit Board and Unimicron Technology are forecasting monthly sales increases through September, reports DigiTimes. Third-quarter revenue is expected to increase 10% to 15% sequentially. According to Compeq, it shipped about 32 million to 35 million handsets in the second quarter. June revenues are expected to remain flat compared to May, on low orders and the slow market recovery in Europe and the US. The company is expecting third-quarter shipments to jump 14% to 25%, with a goal of 40 million units; HDI shipments for the quarter are expected to remain stable. Unimicron reported utilization rates for PCB, HDI and IC substrate production are over 80%. Second-quarter revenues are expected to increase by at least 30%, reports DigiTimes. Smartphone, mid-range to high-end handset, GPS and automotive PCBs shipments are on the rise, reports Unitech. Smartphone demand, not surprisingly, is particularly strong.
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Products
Sensor Products Introduces Tactilus Heat-Sink Analysis System
Tactilus heat-sink analysis system enables test and correction of surface contact and pressure distribution between the heat sink and its source. Can visualize actual contact forces and pressure distribution data on the components. As mounting screws between the CPU and the heat sink are torqued, it maps and measures the changing pressure distribution between the mating surfaces and displays it. Can be tested, manipulated, and repositioned in real-time. Provides pressure data needed for FEA simulation predictions. Is 0.015" thick; can be placed between the CPU and heat sink without affecting...
Tactilus heat-sink analysis system enables test and correction of surface contact and pressure distribution between the heat sink and its source. Can visualize actual contact forces and pressure distribution data on the components. As mounting screws between the CPU and the heat sink are torqued, it maps and measures the changing pressure distribution between the mating surfaces and displays it. Can be tested, manipulated, and repositioned in real-time. Provides pressure data needed for FEA simulation predictions. Is 0.015" thick; can be placed between the CPU and heat sink without affecting...
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EMS’ Rude Awakening
Can high-mix, low-volume production succeed in China? You bet. In the 1970s, if you set up a contract manufacturing shop in a good location, customers eventually would walk through the doors. In the real world, things quickly changed for American companies, as OEMs, driven by maximizing shareholder value, searched for cheaper sources offshore. The first options were Hong Kong, Malaysia and Singapore. After prices increased in these countries, greener pastures were found in China....
Can high-mix, low-volume production succeed in China? You bet. In the 1970s, if you set up a contract manufacturing shop in a good location, customers eventually would walk through the doors. In the real world, things quickly changed for American companies, as OEMs, driven by maximizing shareholder value, searched for cheaper sources offshore. The first options were Hong Kong, Malaysia and Singapore. After prices increased in these countries, greener pastures were found in China....
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