| Hitachi Claims 40% Cut in Design Time |
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| Tuesday, 30 June 2009 10:37 | |||
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SAN JOSE, CA and TOKYO – As part of its companywide initiative to reduce design cycle time and improve efficiency, Hitachi Ltd. has employed Cadence Design Systems’ Global Route Environment (GRE) technology for Allegro PCB design. Hitachi reports the measure has reduced PCB place-and-route design time by 40% for high-speed communication products. The company used the GRE technology on its PCB place-and-route from interconnect planning to complete routing, with full constraints for high-speed digital signals where automation had not been previously available. Hitachi feels the technology will also be effective for other PCB design challenges, such as engineering changes and routing estimation. It plans to use GRE as a standard solution throughout the design environment. GRE technology provides automaton for various stages of interconnect planning and routing where no automation has been available.
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| Last Updated on Tuesday, 30 June 2009 11:35 |
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Sensor Products Introduces Tactilus Heat-Sink Analysis System
Tactilus heat-sink analysis system enables test and correction of surface contact and pressure distribution between the heat sink and its source. Can visualize actual contact forces and pressure distribution data on the components. As mounting screws between the CPU and the heat sink are torqued, it maps and measures the changing pressure distribution between the mating surfaces and displays it. Can be tested, manipulated, and repositioned in real-time. Provides pressure data needed for FEA simulation predictions. Is 0.015" thick; can be placed between the CPU and heat sink without affecting...
Tactilus heat-sink analysis system enables test and correction of surface contact and pressure distribution between the heat sink and its source. Can visualize actual contact forces and pressure distribution data on the components. As mounting screws between the CPU and the heat sink are torqued, it maps and measures the changing pressure distribution between the mating surfaces and displays it. Can be tested, manipulated, and repositioned in real-time. Provides pressure data needed for FEA simulation predictions. Is 0.015" thick; can be placed between the CPU and heat sink without affecting...
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EMS’ Rude Awakening
Can high-mix, low-volume production succeed in China? You bet. In the 1970s, if you set up a contract manufacturing shop in a good location, customers eventually would walk through the doors. In the real world, things quickly changed for American companies, as OEMs, driven by maximizing shareholder value, searched for cheaper sources offshore. The first options were Hong Kong, Malaysia and Singapore. After prices increased in these countries, greener pastures were found in China....
Can high-mix, low-volume production succeed in China? You bet. In the 1970s, if you set up a contract manufacturing shop in a good location, customers eventually would walk through the doors. In the real world, things quickly changed for American companies, as OEMs, driven by maximizing shareholder value, searched for cheaper sources offshore. The first options were Hong Kong, Malaysia and Singapore. After prices increased in these countries, greener pastures were found in China....
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