| Signal Integrity Courses This Summer |
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| Wednesday, 17 June 2009 09:45 | |||
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HILLSBORO, OR – Eric Bogatin of Bogatin Enterprises will present two signal integrity classes this summer. “Essential Principles of Signal Integrity” (EPSI) will be held August 11 to 12. It will focus on building a strong intuitive foundation by discussing paramount signal integrity problems, identifying the root causes and finding the solutions. “Advanced Signal Integrity Design” (ASID) will take place August 13 to 14. The class will discuss analysis techniques to gain confidence in signal integrity design for electronic systems with clocks under 1 GHz. He will also present a free webinar, “Link Analysis with Return Path Discontinuities,” on July 7. For more information on classes, visit: http://www.bethesignal.net/bogatin/index.php.
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Design News
- IEEE Reiterates Globecom Papers Deadline
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- Virtual PCB Draws Record 2,500 Registrants
- Mentor Acquires Zeland
- Technical Chats, Webinars Highlight Virtual PCB Today
- Banner Year: Altium Adds 500 US Customers
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- Altium Design Data Management Webinar to be Held Feb. 25
Market News
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- NA January PWB Orders Up 22% YoY
- Chip Sales to Spike 20% in 2010
- GIPC Lobbies Congress on IP Measures
- Semi B2B Hits Highest Mark in 5 Years
- China's Electronics, IT Profits Up 5.2% in 2009
Fab News
- Advanced Circuits Acquires Circuit Express
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- Kingboard Chemical Reports 2009 Profit Up 40%
- K &F Signs on for Virtual PCB
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- Dow Increases Epoxy Prices in Asia Pacific
Products
Automatic Lamination Techologies Debuts VA 7124 HP6 Vacuum Applicator
VA 7124 HP6 is for applying dry-film solder mask, copper foil, photoimageable cover layers and selective plating. Features stainless steel construction, suitable for clean rooms; dynamic and static slap down cycles; and multilingual operator interface. Lamination pressure is adjustable from 1 to 6 Kg/ cm² (14 to 85.3 PSI). Maximum lamination temp. is 180°C (356°F).Automatic Lamination Techologies, www.dynachem.eu
VA 7124 HP6 is for applying dry-film solder mask, copper foil, photoimageable cover layers and selective plating. Features stainless steel construction, suitable for clean rooms; dynamic and static slap down cycles; and multilingual operator interface. Lamination pressure is adjustable from 1 to 6 Kg/ cm² (14 to 85.3 PSI). Maximum lamination temp. is 180°C (356°F).Automatic Lamination Techologies, www.dynachem.eu
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Printing Screens Revisited
Research continues on improving printed frontside silver conductor line efficiency.A simple Internet search will reveal the photovoltaic industry is working hard on higher aspect ratio frontside conductor grids as a route to greater solar cell efficiencies. This is because the conductors, typically screen-printed on a cell’s frontside, block sunlight from reaching the energy converting strata below, and the narrower they are, the less shadow they cast. However, as it is essential they...
Research continues on improving printed frontside silver conductor line efficiency.A simple Internet search will reveal the photovoltaic industry is working hard on higher aspect ratio frontside conductor grids as a route to greater solar cell efficiencies. This is because the conductors, typically screen-printed on a cell’s frontside, block sunlight from reaching the energy converting strata below, and the narrower they are, the less shadow they cast. However, as it is essential they...
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