| Sunstone Offers Affordable Option for 2-Layer PCBs |
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| Wednesday, 10 June 2009 12:28 | |||
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MULINO, OR – Sunstone Circuits introduces ValueProto PCBs, providing an affordable option when ordering 2-layer PCBs in small quantities that do not require expedited delivery. The boards must measure between 0.25 inches and 14 inches in length, with a surface area less than 168 square inches. These double-sided boards are not limited to a rectangular shape. Pricing includes 2-sided solder mask application with an option of top-side legend. Around-the-clock live email support, as well as free shipping within two weeks, is available. Customers can visit: www.ValueProto.com to place orders.
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Products
ANSYS Releases Ansoft Designer 6.0
Ansoft Designer 6.0 Solver on Demand technology analyzes signal-integrity, power-integrity and electromagnetic interference problems from a single schematic- and layout-based environment. Can access field and circuit simulation tools while designing electronic packages and PCBs early in the design cycle. Integrates HFSS 3-D electromagnetic field simulation software and HSPICE IC simulation. Can predict how high-frequency electromagnetic components affect ICs. Provides user interface to HSPICE with direct links to HFSS and access to the ANSYS QuickEye and VerifEye convolution and statistical...
Ansoft Designer 6.0 Solver on Demand technology analyzes signal-integrity, power-integrity and electromagnetic interference problems from a single schematic- and layout-based environment. Can access field and circuit simulation tools while designing electronic packages and PCBs early in the design cycle. Integrates HFSS 3-D electromagnetic field simulation software and HSPICE IC simulation. Can predict how high-frequency electromagnetic components affect ICs. Provides user interface to HSPICE with direct links to HFSS and access to the ANSYS QuickEye and VerifEye convolution and statistical...
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Component Layout“PCB Design and Assembly for Flip-Chip and Die Size CSP”Author: Vern Solberg; vsolberg123@aol.com.Abstract: This paper outlines the basic elements furnished in the newly released IPC-7094, Design and Assembly Process Implementation for Flip-Chip and Die Size Components, providing a comparison of existing and emerging wafer-level and chip-size package methodologies. The focus is on the effect of PCB design and assembly of bare die or die-size components in an uncased or...
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