| NA Rigid PCB Shipments Down 7% in November |
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| Written by Kathy Nargi-Toth | |||
| Monday, 29 December 2008 13:03 | |||
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BANNOCKBURN, IL -- The IPC announced the North American PCB shipment and booking results for November 2008. Rigid PCB shipments were down 5.8% and bookings down 17.3% in November compared to 2007. Year-to-date rigid PCB shipments were still up 2.4% but and YTD bookings were down 3.8%. Rigid PCB shipments decreased 0.2% and bookings decreased 5.8% compared to October. The book-to-bill ratio for the North American rigid PCB industry in November 2008 slipped again falling to 0.94. The ratio has been below 1.0 since May of 2008, indicating market contraction. Flexible circuit activity in November 2008 was also down with shipments down 22.6% and bookings down 36.8% compared 2007. “PCB orders and shipments continued to decline in November, with flexible circuits being especially hard hit,” said IPC President Denny McGuirk. “Overall, the industry’s sales are slowing as the recession deepens. We expect total industry sales to end the year at about the same level as 2007,” he added. The combined rigid and flex shipments were down 7% when comparing November 2008 with November 2007. Bookings were down 18.8% for the same period. The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in IPC’s survey sample. In November, 86% of the total PCB shipments reported by companies participating in the survey were produced domestically.
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Sensor Products Introduces Tactilus Heat-Sink Analysis System
Tactilus heat-sink analysis system enables test and correction of surface contact and pressure distribution between the heat sink and its source. Can visualize actual contact forces and pressure distribution data on the components. As mounting screws between the CPU and the heat sink are torqued, it maps and measures the changing pressure distribution between the mating surfaces and displays it. Can be tested, manipulated, and repositioned in real-time. Provides pressure data needed for FEA simulation predictions. Is 0.015" thick; can be placed between the CPU and heat sink without affecting...
Tactilus heat-sink analysis system enables test and correction of surface contact and pressure distribution between the heat sink and its source. Can visualize actual contact forces and pressure distribution data on the components. As mounting screws between the CPU and the heat sink are torqued, it maps and measures the changing pressure distribution between the mating surfaces and displays it. Can be tested, manipulated, and repositioned in real-time. Provides pressure data needed for FEA simulation predictions. Is 0.015" thick; can be placed between the CPU and heat sink without affecting...
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Can high-mix, low-volume production succeed in China? You bet. In the 1970s, if you set up a contract manufacturing shop in a good location, customers eventually would walk through the doors. In the real world, things quickly changed for American companies, as OEMs, driven by maximizing shareholder value, searched for cheaper sources offshore. The first options were Hong Kong, Malaysia and Singapore. After prices increased in these countries, greener pastures were found in China....
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